Method for making laminated integrated circuit devices

Details Method for making laminated integrated circuit devices Method for making laminated integrated circuit devices

1996-05-29

1998-06-30

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156282, 156285, 156311, 156312, 156351, 156358, 156359, 156382, 438 5, 438109, B32B 3100

Patent

active

057728151

ABSTRACT:
A method for producing laminated integrated circuit cubes includes applying conductive heat to the cube using at least one conductive heating device. A vacuum is created around the cube to remove air and other gases from between the integrated circuit layers prior to curing. A force is applied to the cube while it is heated under vacuum. A cooling gas is then circulated over the cube. Temperature and force sensing can be performed, and the process can be controlled by programmable logic controllers and the like.

REFERENCES:
patent: 3960635 (1976-06-01), La Roy et al.
patent: 4421589 (1983-12-01), Armini et al.
patent: 4646128 (1987-02-01), Carson et al.
patent: 4666551 (1987-05-01), Soberay et al.
patent: 4672737 (1987-06-01), Carson et al.
patent: 4689105 (1987-08-01), Fazlin et al.
patent: 4704319 (1987-11-01), Belanger et al.
patent: 4706166 (1987-11-01), Go
patent: 4764846 (1988-08-01), Go
patent: 4806195 (1989-02-01), Namysl
patent: 4983533 (1991-01-01), Go
patent: 5017586 (1991-05-01), Eichelberger et al.
patent: 5045685 (1991-09-01), Wall
patent: 5104820 (1992-04-01), Go et al.
patent: 5218515 (1993-06-01), Bernhardt
patent: 5221642 (1993-06-01), Burns
patent: 5241450 (1993-08-01), Bernhardt et al.
patent: 5279991 (1994-01-01), Minahan et al.
patent: 5297480 (1994-03-01), Miyashita et al.
patent: 5347428 (1994-09-01), Carson et al.
patent: 5424920 (1995-06-01), Miyake
patent: 5432318 (1995-07-01), Minahan
patent: 5432729 (1995-07-01), Carson et al.

Affiliated with

Also associated with

Rating

Method for making laminated integrated circuit devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making laminated integrated circuit devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making laminated integrated circuit devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1855118