Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1992-09-03
2000-06-20
Chaudhuri, Olik
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438107, 438109, 438118, 438119, H01L 2144
Patent
active
060777257
ABSTRACT:
A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such multichip module.
REFERENCES:
patent: 3716907 (1973-02-01), Anderson
patent: 3763550 (1973-10-01), Oakes
patent: 4067104 (1978-01-01), Tracy
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4509994 (1985-04-01), Barajas
patent: 4654752 (1987-03-01), Kyle
patent: 4784310 (1988-11-01), Metzger et al.
patent: 4840924 (1989-06-01), Kimbara
patent: 4872261 (1989-10-01), Sanyal et al.
patent: 4878611 (1989-11-01), Lovasco et al.
patent: 4898117 (1990-02-01), Ledermann et al.
patent: 4942140 (1990-07-01), Ootsuki et al.
patent: 4960236 (1990-10-01), Hedges et al.
patent: 4991000 (1991-02-01), Bone et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5009724 (1991-04-01), Dodd et al.
patent: 5024372 (1991-06-01), Altman et al.
patent: 5032543 (1991-07-01), Black et al.
patent: 5041169 (1991-08-01), Oddy et al.
patent: 5046415 (1991-09-01), Oates
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5088189 (1992-02-01), Brown
patent: 5109320 (1992-04-01), Bourdelaise et al.
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5130768 (1992-07-01), Wu et al.
patent: 5150832 (1992-09-01), Degani et al.
patent: 5176759 (1993-01-01), Taguchi
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5223033 (1993-06-01), King et al.
patent: 5245750 (1993-09-01), Crumly et al.
patent: 5246880 (1993-09-01), Reele et al.
patent: 5250469 (1993-10-01), Tanaka et al.
patent: 5261593 (1993-11-01), Casson et al.
patent: 5313366 (1994-05-01), Gaudenzi et al.
patent: 5315241 (1994-05-01), Ewars
patent: 5341564 (1994-08-01), Akhauain et al.
"High-Density, Low Temperature Solder Reflow Bonding of Silicon Chips to Plastic Substrates"; L.Kuhn et al., IBM T.D.B., vol. 18, No. 10, 3-76, p.3477.
Microelectronics Packaging Handbook; New York, Van Nostrand Reinhold, 1989. pp. 827, 829, 369, 371, TK 7874.T824 1988.
"Motorola ready to enter multichip module market" by T. Costlow, Electronic Engineering Times. May 18, 1992. p. 4.
"Meeting Global MCM Manufacturing Challenges" by M.C. Tucker, Amoco Chemical Company, Chicago, Illinois, Solid State Technology. Jun. 1992, p. 101.
Degani Yinon
Dudderar Thomas Dixon
Tai King Lien
Chambliss Alonzo
Chaudhuri Olik
Lucent Technologies Inc
Williamson Samuel R.
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