System and method for plasma etch on a spherical shaped device

Details System and method for plasma etch on a spherical shaped device System and method for plasma etch on a spherical shaped device

1999-07-08

2000-06-20

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118723E, 118723DC, H05H 100, C23C 1600

Patent

active

06077388&

ABSTRACT:
A system and method for performing plasma etch on a spherical shaped device is disclosed. The system includes a processing tube for providing a reactive chamber for the spherical shaped substrate and a plasma jet is located adjacent to the processing tube. The plasma jet includes a pair of electrodes, such as a central cathode and a surrounding anode, for producing a plasma flame directed towards the reactive chamber. The central cathode may, for example, be powered by a radio frequency power source. As a result, the reactive chamber supports non-contact etching of the spherical shaped substrate by the plasma flame.

REFERENCES:
patent: 4786477 (1988-11-01), Yoon et al.
patent: 5549780 (1996-08-01), Koinuma et al.
patent: 5955776 (1999-09-01), Ishikawa
Application No. 09/033,180, filed on Mar. 2, 1998, entitled: Inductively Coupled Plasma Powder Vaporization for Fabricating Integrated Circuits, by Ivan Murzin and Ram Ramamurthi, copy of first page of specification, abstract and figure No. one (Attorney Docket No. 22397.61).
Application No. 09/032,965, filed on Mar. 2, 1998, entitled: Plasma Immersion Ion Processor for Fabricating Semiconductor Integrated Circuits, by Ivan Murzin and Yanwei Zhang, copy of first page of specification, abstract and figure No. one (Attorney Docket No. 22397.62).
Application No. 09/069,645, filed on Apr. 29, 1998, entitled: Plasma-Assisted Metallic Film Deposition, by Changfeng Xia, copy of first page of specification, abstract and figure No. one (Attorney Docket No. 22397.68).
Heberlein, J.; Ffender E., Materials Science Forum, vol. 140-142, pp. 477-496, 1993.

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