Method of packaging a semiconductor device

Details Method of packaging a semiconductor device Method of packaging a semiconductor device

1991-07-29

1992-10-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

140105, 174 524, 206328, H01R 4300

Patent

active

051559021

ABSTRACT:
A semiconductor device comprising a semiconductor unit with leads extending therefrom is placed on a bottom packaging tray having a die-shaped upper surface. A top lubricating type film is used over the device 10 and below a punch unit that is used to bend the leads. A process of assembling the semiconductor device on a die type package is disclosed which includes placing the semiconductor device with leads on a packaging tray with upper lead-shaped baring surfaces, placing an anti-friction film sheet over the tray and over the device with its leads extending therefrom, and actuating a punch unit disposed above the film sheet, thereby forming or bending the leads and simultaneously using the die type tray for packaging the semiconductor device.

REFERENCES:
patent: 4553420 (1985-11-01), Fierkens et al.
patent: 4706811 (1987-11-01), Jung
patent: 4747017 (1988-05-01), Koors
patent: 5027866 (1991-07-01), Matsumoto

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