Semiconductor wafer lifter

Metal working – Barrier layer or semiconductor device making

Patent

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Details

118500, 483 14, H01L 2168

Patent

active

051558882

ABSTRACT:
A wafer lifting apparatus is comprised of guide rails (10) that are disposed on a supporting surface (22). A lifting apparatus (24) is disposed on the surface (22), having an inclined surface (26). Grooves (28) are disposed on the inclined surface and spaced apart a distance equal to that of wafers (20) in a wafer handling boat (16). The wafer handling boat (16) has the end pieces (12) and (14) urged downward into the guide rails (10) until the lowermost peripheral edges of the wafers (20) contact the grooves (28) in the inclined surface (26). When fully lowered, the rearmost ones of the wafers (20) are completely lifted out of the boat such that they are supported entirely by the grooves (28). In this manner, they can be viewed from the end of the wafer lifting apparatus. A flat finding device in the form of a flat finding cylinder (44) is also provided in an opening (38) on a supporting surface (36) for holding the boat (16). The wafer handling cylinder (44) is operated to find the flat (32) on the wafer (20) and then a platform (54) urged upward from underneath the surface (36) to urge the wafers (20) upward on combs (68) and (70), that are also disposed at an inclined angle.

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