Method of chemically-mechanically polishing an electronic compon

Details Method of chemically-mechanically polishing an electronic compon Method of chemically-mechanically polishing an electronic compon

1997-07-09

1998-05-19

Smith, James G.

Abrading

Abrading process

Glass or stone abrading

451 28, B24B 100

Patent

active

057528756

ABSTRACT:
A method of chemically polishing aluminum from a semiconductor wafer to leave a wiring pattern thereon. The surface of the aluminum in aqueous environment consists of hydrated alumina; upon contact with the hydrated silica particles of a polishing slurry at neutral pH, the surface alumina is transferred to the surface of the silica by aluminosilicate formation removing the alumina layer by layer by contact chemical reaction. Wafers thus polished have nearly scratch-free and corrosion-free polished aluminum lines in an insulator surface.

REFERENCES:
patent: 4132037 (1979-01-01), Bonora
patent: 4376148 (1983-03-01), McCartney
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 4879258 (1989-11-01), Fisher
patent: 4910155 (1990-03-01), Cote et al.
patent: 4959113 (1990-09-01), Roberts
patent: 5007128 (1991-04-01), Englund et al.
patent: 5084071 (1992-01-01), Nenadic et al.
patent: 5185964 (1993-02-01), Englund et al.
patent: 5209816 (1993-05-01), Yu et al.
patent: 5228886 (1993-07-01), Zipperian
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5302551 (1994-04-01), Iranmanesh et al.
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5396737 (1995-03-01), Englund et al.
patent: 5407526 (1995-04-01), Danielson et al.
patent: 5486265 (1996-01-01), Salugsugan
patent: 5527423 (1996-06-01), Neville et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5609511 (1997-03-01), Moriyama et al.

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