Method of forming a three-dimensional printed circuit assembly

Details Method of forming a three-dimensional printed circuit assembly Method of forming a three-dimensional printed circuit assembly

1992-10-22

1993-11-23

Tentoni, Leo B.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29848, 29849, 29850, 156221, 1562728, 1562735, 1562755, 1563071, 264 22, 264 25, 264236, 26427217, 264308, 264322, 427 96, 427 98, 4273935, 427446, 427493, 427508, 427510, 427512, 427521, 427553, 427554, 427581, 437230, B05D 512, B29C 3508, B29C 4102

Patent

active

052640612

ABSTRACT:
A three-dimensional printed circuit assembly is formed by first making a substrate (20). A substrate (20) is first formed from a photoactive polymer (14) that is capable of altering its physical state when exposed to a radiant beam (30). At this point, the substrate is only partially cured. A conductive circuit pattern (50) is then formed on the partially cured substrate. The substrate is then molded to create a three-dimensional structure, and then further cured to cause the photoactive polymer to harden.

REFERENCES:
patent: 4929402 (1990-05-01), Hull
patent: 4996010 (1992-02-01), Modrek
patent: 4999143 (1991-03-01), Hull
patent: 5008496 (1991-04-01), Schmidt et al.
patent: 5173220 (1992-12-01), Reiff et al.

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