Integrated circuit package having coaxial pins

Details Integrated circuit package having coaxial pins Integrated circuit package having coaxial pins

1987-08-26

1989-04-04

Pellinen, A. D.

Electricity: electrical systems and devices

Miscellaneous

361406, 361413, 361425, 439 65, 439 75, H05K 114

Patent

active

048191310

ABSTRACT:
An integrated circuit package including a multilayer ceramic substrate for mounting a plurality of integrated circuit chips on a first surface thereof. The substrate is provided with a power supply layer, a ground connection layer and circuit patterns. An array of coaxial pins is juxtaposed on the opposite surface of the substrate. Each coaxial pin includes an inner conductor and an outer conductor. The inner conductor of one or more coaxial pins is connected to the power supply layer and the inner conductors of the remaining coaxial pins are connected to the circuit patterns. The outer conductors of all the coaxial pins are connected to the ground connection layer.

REFERENCES:
patent: 4231629 (1980-11-01), Kirby
patent: 4612601 (1986-09-01), Watari
Heath et al., "Coaxial Connector", IBM Technical Disclosure Bulletin, vol. 21, No. 10, Mar. 1979, pp. 3987-3988.

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