Method of fabricating a thermally enhanced lead frame

Details Method of fabricating a thermally enhanced lead frame Method of fabricating a thermally enhanced lead frame

1995-09-01

1997-11-04

Niebling, John

Fishing, trapping, and vermin destroying

437217, 437209, 257676, H01L 2158, H01L 2160

Patent

active

056839448

ABSTRACT:
The device has a semiconductor die (18) mounted upon a downset X-shape die support (12) of a lead frame (10, 40). The lead frame also has tie bars (16) which are connected to the X-shape die support. Attached to the tie bars are thermal bars (14, 14') which are located between the semiconductor die and inner portion of the leads (20). The inner portion of the leads, the tie bars, and the thermal bars are offset from the plane occupied by the X-shape die support. The thermal bars aid in dissipating the heat from the die into the nearby lead tips so that the heat can be conducted out of the package body (30) through the thermally conductive lead frame. The semiconductor die is wire bonded to the inner portion of the leads. A package body (30) protects the die, the wire bonds (26), the thermal bars, and the inner portion of the leads.

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