Styrenic resin laminate and molding thereof

Details Styrenic resin laminate and molding thereof Styrenic resin laminate and molding thereof

1996-04-29

1997-11-04

McCamish, Marion E.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

4283199, 4289033, 428910, B32B 2706

Patent

active

056838018

ABSTRACT:
There are disclosed a styrenic resin laminate comprising at least one surface layer consisting essentially of a styrenic polymer having a high degree of syndiotactic configuration (SPS layer) and a foam layer (other layer) consisting essentially of a styrenic resin (GPPS, IPS, HIPS, ABS resin, SMA copolymer, AS resin, modified PPO; blend of HIPS/PPO, etc); and a molding obtained by thermoforming the above-mentioned laminate. The above laminate is particularly excellent in heat resistance and easily thermoformable into the molding, which is also excellent in heat resistance and recyclability in terms of retention of flexural strength, utilizable in heating oil-base food with a microwave range and can easily be recovered for reuse, thereby greatly contributing to environmental preservation and resources saving.

REFERENCES:
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patent: 4680353 (1987-07-01), Ishihara et al.
patent: 5004649 (1991-04-01), Yamasaki et al.
patent: 5089353 (1992-02-01), Negi et al.
patent: 5109068 (1992-04-01), Yamasaki et al.
patent: 5270442 (1993-12-01), Nakano
Database WPI, AN-90-087693, JP-A-02 041 225, Feb. 9, 1990.
Chemical Abstracts, vol. 110, No. 16, Apr. 17, 1989, AN-136588v, JP-A-63 278 831, Nov. 16, 1988.
Chemical Abstracts, vol. 115, No. 14, Oct. 7, 1991, AN-137747m, JP-A-03 126 521, May 29, 1991.

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