Resin seal type semiconductor device

Details Resin seal type semiconductor device Resin seal type semiconductor device

1991-03-11

1992-02-18

Epps, Georgia

357 70, 357 69, H01L 2328

Patent

active

050898795

ABSTRACT:
A resin seal type semiconductor device comprises a lead frame having a support and a plurality of leads, a semiconductor chip mounted on the die support and having a plurality of pads connected to the leads. Furthermore, the device has a wire lead arranged above the semiconductor chip. For example, power source is supplied from the lead supplying power source to one of the pads receiving power source, by connecting the lead and the one pad. Furthermore, power source is supplied from the lead to another pad located far from the one pad by connecting the lead and the another pad through the wire lead.

REFERENCES:
patent: 4661837 (1987-04-01), Sono
patent: 4814943 (1989-03-01), Okuaki
patent: 4985751 (1991-01-01), Shiobara et al.

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