Hermetic package for a high power semiconductor device

Details Hermetic package for a high power semiconductor device Hermetic package for a high power semiconductor device

1994-01-06

1995-08-29

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257698, 257697, 257773, H01L 2302, H01L 2310

Patent

active

054463165

ABSTRACT:
A compact package and a method of hermetically packaging a high power semiconductor device includes a metal lid bonded to a ceramic base with the semiconductor device therebetween. The lid is bonded to one surface of the device, and electrical contacts on the opposing surface of the device are bonded to foils that seal openings in the base for contact pins.

REFERENCES:
patent: 3723836 (1973-03-01), Shekerjial et al.
patent: 4445274 (1984-05-01), Suzuki et al.
patent: 4987478 (1991-01-01), Braun et al.
patent: 5184211 (1993-02-01), Fox
patent: 5248901 (1993-09-01), Temple

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