Photosensitive polyimide precursors

Details Photosensitive polyimide precursors Photosensitive polyimide precursors

1993-12-17

1995-08-29

Berman, Susan W.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522904, 522905, 522136, 430195, 430281, 430194, 525420, 525436, 525928, 528128, 528229, 528335, G03C 152, C08G 6926, C08J 328

Patent

active

054460743

ABSTRACT:
New photosensitive polyamic acid precursors are disclosed which have the formula: ##STR1## where Z is a tetravalent organic radical which contains at least one aromatic ring, Z' is a divalent organic radical which contains at least one aromatic ring, and R* is a photosensitive group. Particularly preferred compounds include BPDA-PDA and BPDA-ODA polyamic acid precursors. The precursor compositions within the practice of this invention are i-line, g-line, and i-/g-line active and show good photoresolution. The films formed exhibit excellent self-adhesion and adhesion to glass ceramic and silicon wafer substrates have low internal stress, a very low degree of solvent swelling, high thermal stability, and excellent mechanical properties such as high modulus/tensile strength and high elongation at break.

REFERENCES:
patent: 3072485 (1960-08-01), Reynolds et al.
patent: 4107174 (1978-08-01), Baumann et al.
patent: 4168366 (1979-09-01), D'Alelio
patent: 4416973 (1983-11-01), Goff
patent: 4430418 (1984-02-01), Goff
patent: 4451551 (1984-05-01), Kataoka et al.
patent: 4454220 (1984-06-01), Goff
patent: 4481340 (1984-11-01), Minnema et al.
patent: 4629777 (1986-12-01), Pfeifer
patent: 4656116 (1987-04-01), Rohde et al.
patent: 4670535 (1987-06-01), Sugio et al.
patent: 4696890 (1987-09-01), Pfeifer
patent: 4698295 (1987-10-01), Pfeifer et al.
patent: 4803147 (1989-02-01), Mueller et al.
patent: 4814233 (1989-03-01), Pfeifer
patent: 4829131 (1989-05-01), Lee
patent: 4830953 (1989-05-01), Bateman
patent: 4851506 (1989-07-01), Rohde et al.
patent: 5238784 (1993-08-01), Tokoh et al.
Ray, S., Berger, D., Czornyg, G., Kumer, A., and Tummala, R., "Dual-Level Metal (DLM) Method for Fabricating Thin Film Wiring Structures", 43rd Electronics Components and Technology Conference (ECTC-IEEE) 1993, pp. 538-543.
Tummala, Rao R., Haley, Michael R., and Czornyj, George, "Materials in Micro-Electronics", Ceramics International, vol. 19(3), 1993, p. 191.

Affiliated with

Also associated with

Rating

Photosensitive polyimide precursors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive polyimide precursors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive polyimide precursors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1819773