Titanium-silver-palladium metallization system and process there

Details Titanium-silver-palladium metallization system and process there Titanium-silver-palladium metallization system and process there

1975-04-04

1976-08-31

James, Andrew J.

357 13, 357 65, 357 68, 357 73, 29588, H01L 2348, H01L 2946, H01L 2954, H01L 2962

Patent

active

039785173

ABSTRACT:
An improved metallization system comprising successive layers of titanium, silver and palladium is disclosed. The system is of particular usefulness in the semiconductor field.

REFERENCES:
patent: 3261075 (1966-07-01), Carman
patent: 3386894 (1968-06-01), Steppat
patent: 3567508 (1971-03-01), Cox et al.
patent: 3686080 (1972-08-01), Banfield et al.

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