Method for treatment fluid application and removal

Details Method for treatment fluid application and removal Method for treatment fluid application and removal

1974-01-02

1976-01-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

96 48PD, 134 37, 156 19, 156 23, 156345, 427424, B08B 704, B05C 500, C23F 100, G03C 524

Patent

active

039350410

ABSTRACT:
Treated articles such as printed circuit boards that have been etched with an etchant or treated with a solvent, are delivered into a zone of sufficiently high humidity to prevent drying of a liquid treatment fluid on the articles, and wherein the treatment fluid is "blown off" the articles by pressurized air, in the high humidity environment, with the treatment fluid then being delivered for re-use at a prior station. Alternately, the treatment fluid is atomized, entrained in the pressurized air stream and "blown on" the articles, whereby the treatment fluid is efficiently and uniformly applied thereto.

REFERENCES:
patent: 2155932 (1939-04-01), Davis
patent: 2523018 (1950-09-01), Henderson
patent: 2822635 (1958-02-01), Mears
patent: 3174491 (1965-03-01), Faler
patent: 3526546 (1970-09-01), Heiss
patent: 3544366 (1970-12-01), Uhlmann

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