Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

1990-10-30

1992-06-09

James, Andrew J.

357 81, 357 74, H01L 2342, H01L 2344

Patent

active

051211890

ABSTRACT:
A flat-pack type semiconductor device has an anode buffer plate (50) on a semiconductor element (1). The anode buffer plate consists of a central position (51) and a plurality of arms (61, 63) extending therefrom. Each of the arms has a straight portion (61a) placed on a guide ring (70) and a hooked-portion (61b) inserted in the gap (73) between the guide ring and an insulating cylinder (10).

REFERENCES:
patent: 3581160 (1971-05-01), Piccone
patent: 4099201 (1978-07-01), Mueller
patent: 4426659 (1984-01-01), de Bruyne et al.
patent: 4918514 (1990-04-01), Matsuda et al.
patent: 4956696 (1990-09-01), Hoppe et al.
patent: 4958215 (1990-09-01), Kojima et al.

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