Pre-bond cavity air bridge

Details Pre-bond cavity air bridge Pre-bond cavity air bridge

1996-05-20

1999-09-07

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257276, 257226, 257522, 257622, 257758, 257680, 438624, 438619, H01L 2712, H01L 2980

Patent

active

059491442

ABSTRACT:
A handle wafer has a cavity coated with a dielectric. A device wafer is bonded to the handle wafer. Metal lines, devices or circuits fabricated on device layer overlay the cavity in the handle wafer thus reducing parasitic capacitances to the handle wafer and crosstalk through the handle wafer. This constitutes a rugged air bridge structure capable of being passivated and/or being placed in plastic packages.

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