Apparatus for testing flip chip or wire bond integrated circuits

Details Apparatus for testing flip chip or wire bond integrated circuits Apparatus for testing flip chip or wire bond integrated circuits

1995-07-05

1997-12-23

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R 107

Patent

active

057010854

ABSTRACT:
An apparatus for use in testing wire bond or flip chip connected integrated circuits includes a housing with a top side, a bottom side, and a perimeter region defining a housing central aperture. The housing further includes flip chip pads to accommodate flip chip solder connections to a flip chip integrated circuit during a first test period and wire bond pads to accommodate wire bond connections to a wire bond integrated circuit during a second test period. There are connector pins on the bottom side of the housing for connection with a printed circuit board. The printed circuit board includes an access aperture which is aligned with the housing central aperture. This configuration allows a test probe to access a flip chip integrated circuit positioned within the housing. It also allows a heat sink to be used when the housing incorporates a wire bonded integrated circuit.

REFERENCES:
patent: 5006792 (1991-04-01), Malhi et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5397997 (1995-03-01), Tuckerman et al.
patent: 5435733 (1995-07-01), Chernicky et al.
patent: 5440240 (1995-08-01), Wood et al.
patent: 5548884 (1996-08-01), Kim

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