Semiconductor device having tab leads

Details Semiconductor device having tab leads Semiconductor device having tab leads

1996-09-03

1997-12-23

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257786, H01L 23495

Patent

active

057010285

ABSTRACT:
A semiconductor device having a semiconductor chip and a TAB lead adhering to a surface of the semiconductor chip by a TAB tape which electrically connects an internal terminal arranged in a center part of a surface of the semiconductor chip to an external terminal arranged around a periphery of the semiconductor chip. One embodiment according to the present invention is an LCO semiconductor device having the TAB lead connecting to a lead-frame assembled in an IC package. Another embodiment according to the present invention is a TAB tape of thermo-plasticity comprising a first surface having a first softening temperature and a second surface having a second softening temperature which is different from the first softening temperature.

REFERENCES:
patent: 5252853 (1993-10-01), Michii
patent: 5296737 (1994-03-01), Nishimura et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5365409 (1994-11-01), Kwon et al.

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