Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1994-04-01
1994-11-01
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257698, 257692, H01L 2348, H01L 2944, H01L 2952, H01L 2960
Patent
active
053609921
ABSTRACT:
The invention comprises a semiconductor package which allows pinouts and bond options to be customized after the encasement of a die in plastic, ceramic, or other suitable materials. A first embodiment of the invention has a first assembly comprising an encapsulated die having bond pads connected to bond wires which terminate in exterior pad portions on the exterior of the encapsulant. Conductive paths which are part of a second assembly electrically connect with the exterior pad portions of the first assembly and pass signals to device pinouts, which can be leads or other connecting means, to an electronic device into which the module is installed. By selectively connecting the exterior pad portions of the first assembly to the connection points of the conductive paths of the second assembly, the device pinouts and bond options can be selected. To manufacture a device having different pinouts or bond options, a bottom section having a different design is used.
REFERENCES:
patent: 3663868 (1972-05-01), Noguchi et al.
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4922324 (1990-05-01), Sudo
patent: 5045921 (1991-09-01), Lin et al.
patent: 5302849 (1994-04-01), Covasin
"Z-Axis Conductive Adhesive" Zymet Inc., 7 Great Meadow Lane, E. Hanover, N.J. 07936.
Lowrey Tyler A.
Martin Kevin D.
Reinberg Alan R.
Clark S. V.
James Andrew J.
Martin Kevin D.
Micro)n Technology, Inc.
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