Process for producing metal/polyimide composite article

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

4274071, 427409, 427404, C23C 2600

Patent

active

051205734

ABSTRACT:
The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal/polyimide composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film and curing it: ##STR1## wherein R.sub.1 and R.sub.2 which may be identical or different each represents an organic group of 1 or more carbon atoms.

REFERENCES:
patent: 4347306 (1982-08-01), Takeda
patent: 4654223 (1987-03-01), Araps
patent: 4656050 (1987-04-01), Araps
patent: 4699803 (1987-10-01), Araps
patent: 4910293 (1990-03-01), Uekita
patent: 4943471 (1990-07-01), Uekita

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