Semiconductor device having ribbon electrode structure and metho

Details Semiconductor device having ribbon electrode structure and metho Semiconductor device having ribbon electrode structure and metho

1981-10-28

1985-05-07

Edlow, Martin H.

357 38, 357 68, 357 69, 357 70, H01L 2974, H01L 2348, H01L 2944, H01L 2952

Patent

active

045161496

ABSTRACT:
A semiconductor device is disclosed which is provided with at least one flexible conducting film having an inner electrode portion and an outer electrode portion. The inner electrode portion is conductively bonded to at least one of two kinds of electrode films formed on one main surface of a semiconductor substrate, and has a form similar to the shape of the electrode film. The outer electrode portion is integrated with the inner electrode portion into one body but is not bonded to the electrode film. The conducting film can be previously bonded to a transparent insulating film, if desired, and is arranged in registry with the electrode film on the semiconductor substrate, while being supported by the insulating film. Accordingly, the inner electrode portion of the conducting film is bonded to the electrode film having a complicated pattern, readily and accurately. The inner electrode portion serves to reduce the electric resistance of the electrode film and to increase the current capacity of the electrode. If a transparent insulating film has been used, it can be removed after device formation, if desired.

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patent: 3822467 (1974-07-01), Symersky
patent: 3900771 (1975-08-01), Krausse
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patent: 4005456 (1977-01-01), Botzenhart
patent: 4028722 (1977-06-01), Helda
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patent: 4240595 (1981-01-01), Noyori et al.
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