Vertically interconnected electronic assemblies and compositions

Details Vertically interconnected electronic assemblies and compositions Vertically interconnected electronic assemblies and compositions

1997-03-06

1999-09-07

Jones, Deborah

Stock material or miscellaneous articles

Composite

Of epoxy ether

428413, 428458, 428901, 252513, 252514, 252518, 174255, 174257, 174265, H01B 102, H01B 122

Patent

active

059485337

ABSTRACT:
In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.

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