Semiconductor device-encapsulating epoxy resin composition

Details Semiconductor device-encapsulating epoxy resin composition Semiconductor device-encapsulating epoxy resin composition

1992-12-11

1994-11-01

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523223, 523427, 523434, 523443, C08K 708

Patent

active

053608372

ABSTRACT:
Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.

REFERENCES:
Translated copy of Japan Kokai 2-99514.

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