Prevention of corrosion of aluminum interconnects by removing co

Details Prevention of corrosion of aluminum interconnects by removing co Prevention of corrosion of aluminum interconnects by removing co

1996-03-25

1997-12-23

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

438720, 438742, 438688, 216 67, 216 77, H01L 2100

Patent

active

057007403

ABSTRACT:
A method is described for the prevention of the corrosion of interconnection wirings made of aluminum or aluminum-copper alloys in semiconductor integrated circuits. The invention uses a weak solution of NH.sub.4 OH to remove chlorine-containing residues that adhere to the sidewalls of the metal wirings patterned by reactive ion etching using chlorine-containing gaseous components, thus effectively quenching the chain reaction of aluminum electrochemical corrosion involving these chlorine-containing residues as an intermediary.

REFERENCES:
patent: 5200031 (1993-04-01), Latchford et al.
patent: 5221424 (1993-06-01), Rhoades
patent: 5248384 (1993-09-01), Lin et al.
patent: 5298112 (1994-03-01), Hayasaka et al.
patent: 5380397 (1995-01-01), Fukuyama et al.
patent: 5411631 (1995-05-01), Hori et al.

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