Plasma polymerized ethane for interlayer dielectric

Details Plasma polymerized ethane for interlayer dielectric Plasma polymerized ethane for interlayer dielectric

1980-12-18

1983-02-15

Dixon, Jr., William R.

Stock material or miscellaneous articles

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204170, 427 34, 427 38, 427 41, 4272556, 428451, 428523, B32B 904, B32B 2732, B05D 306

Patent

active

043741797

ABSTRACT:
A plasma polymerized ethane thin film deposited on a variety of substrates has been discovered to be an improved interlayer dielectric. It is a material having property of high dielectric strength and unique low dielectric constant. It also has advantages of depositing pinhole free, crack resistant with good step coverage and low deposition cost.

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patent: 4020221 (1977-04-01), Kusakawa et al.
patent: 4132829 (1979-01-01), Hudis
patent: 4136225 (1979-01-01), Feit et al.
patent: 4227039 (1980-10-01), Shibasaki et al.
patent: 4269896 (1981-05-01), Yamagishi
Hiratsuka et al., "Plasma Polymerization of Some Simple Saturated Hydrocarbons", Journal of Applied Science, 22(4), Apr. 1978, pp. 917-925.
Morita et al., "Effect of Discharge Frequency on the Plasma Polymerization of Ethane", Organic Coatings and Plastic Chemistry, 40, pp. 451-455, Apr. 1979.
Tibbett et al., "IR Laser Window Coating by Plasma Polymerized Hydrocarbons", Fifth Conference on Infrared Laser Materials, Feb. 1976, pp. 205-212.

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