Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1984-08-08
1987-05-12
Childs, Sadie L.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427102, B05D 512
Patent
active
046649450
ABSTRACT:
Disclosed is a method for forming thick film circuits or the like to be used when forming elements such as conductors and resistors on a thick film circuit board. The method is performed with a writing head for storing paste to form patterns and which lowers and approaches an arbitrary point in close proximity to the board of a thick film circuit and while same state, moves laterally to another other arbitrary point along the surface of the board, and then ascends to be separated from the board. The paste in the writing head is pressurized to be forced out of the head before the writing head begins to move laterally such that the paste is immediately applied on the board when the writing head begins to move laterally. This pressurization of the paste is stopped before the writing head finishes its lateral movement, so that the extrusion of the paste may be stopped the moment the writing head finishes the lateral movement. As a result, blurring or blotting at the beginning and ending part of the pattern writing may be prevented, so that patterns may be formed at high speed and with high precision.
REFERENCES:
patent: 3820121 (1974-06-01), Rich et al.
patent: 3864695 (1975-02-01), Nagashima et al.
patent: 3961599 (1976-06-01), Jones, Jr.
patent: 4133910 (1979-01-01), Ruwe et al.
patent: 4291642 (1981-09-01), Kolc
patent: 4324815 (1982-04-01), Mitani et al.
patent: 4327124 (1982-04-01), DesMarais
patent: 4338351 (1982-07-01), Bloom et al.
patent: 4485387 (1984-11-01), Drumheller
Electronic Packing and Production, pp. 98-109, Jan. 1981.
Kudo Shin-ichi
Maeda Yukio
Childs Sadie L.
Matsushita Electric - Industrial Co., Ltd.
LandOfFree
Method of forming thick film circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming thick film circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming thick film circuits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1801782