Structure to reduce stress in multilayer ceramic substrates

Details Structure to reduce stress in multilayer ceramic substrates Structure to reduce stress in multilayer ceramic substrates

1996-06-24

1997-12-23

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 361711, B32B 300, H05K 720

Patent

active

057005494

ABSTRACT:
A multilayer ceramic substrate for microelectronics includes stress relief pads to reduce stress in the vicinity of functional vias penetrating through multiple ceramic layers. The stress relief pads are located only on the major surface of a ceramic layer and accordingly do not prevent wiring from being placed directly below the stress relief pads on the bottom surface of the same layer or the top surface of the imediately underlying layer. The invention also includes the method of making the multilayer ceramic substrate with stress relief pads.

REFERENCES:
patent: 5093186 (1992-03-01), Kimura et al.
patent: 5130498 (1992-07-01), Yoshida et al.
patent: 5293503 (1994-03-01), Nishigoori
patent: 5354599 (1994-10-01), McClanahan et al.
patent: 5451720 (1995-09-01), Estes et al.
patent: 5453913 (1995-09-01), Koyanagi
IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977 "Dummy Pads For Increased Creep Resistance".
IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, "Via Design Minimize Stress Levels In Multilayer Ceramic Substrates".

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