Tin/lead plating bath and method

Details Tin/lead plating bath and method Tin/lead plating bath and method

1978-01-03

1978-10-03

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 356, C25D 360

Patent

active

041182898

ABSTRACT:
A plating bath for electrodeposition of tin/lead alloys contains stannous ion, lead ion, a fluoborate, fluosilicate or sulfamate radical and, as a brightener system, a nonionic polyoxyalkylated surfactant, a lower aliphatic aldehyde, an amine and a cyclic brightener selected from the group consisting of heterocyclic carboxaldehydes, aromatic ketones and carboxylic acids, the pH of the bath being less than about 3.0.

REFERENCES:
patent: 3661730 (1972-05-01), Nishihara
patent: 3730853 (1973-05-01), Sedlacek et al.
patent: 3769182 (1973-10-01), Hsu
patent: 3785939 (1974-01-01), Hsu
Frederick A. Lowenheim, "Modern Electroplating", pp. 462-463, (1968).

Affiliated with

Also associated with

Rating

Tin/lead plating bath and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tin/lead plating bath and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tin/lead plating bath and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1800520