Simplified method of making vias for merged MR head

Details Simplified method of making vias for merged MR head Simplified method of making vias for merged MR head

1995-06-07

1997-12-23

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating article containing magnetically...

216 39, 360113, 2960307, G11B 5187, B44C 122

Patent

active

057003807

ABSTRACT:
An improved method of manufacturing is provided for making an improved merged MR head. The method employs a photoresist mask with appropriately-sized openings for simultaneously etching numerous vias to various depths over a set time period. After formation of the vias, a single photoresist mask is employed to pattern in one step gap layers G3, G2, G1 and a first shield layer S1 to the desired lateral configuration for the merged MR head. Subsequent to patterning these thin film layers, double insulation layers I2 and I3 are individually soft baked on top of the coil structure of the head followed by patterning of the layers I2/I3 by a single photoresist mask. These layers are then hard baked to retain the desired smooth configuration of the layers. The improved merged MR head has a smooth configuration to its top pole piece P2 because of the smooth configuration of the I2/I3 layer so that flux leakage and saturation problems are minimized.

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