Method of checking connected state between IC socket and printed

Details Method of checking connected state between IC socket and printed Method of checking connected state between IC socket and printed

1996-03-20

1997-12-23

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

174262, 174263, 228105, 324538, H01K 900

Patent

active

056996128

ABSTRACT:
An IC socket for mounting an IC package on a printed wiring board includes a socket body and pin terminals. The socket body has a mount portion for the IC package. The mount portion has a flat bottom wall. The pin terminals are arranged in the bottom wall at predetermined intervals lengthwise and widthwise. Each pin terminal has a contact portion, on the upper surface of the mount portion, which is brought into contact with a corresponding terminal of the IC package mounted on the mount portion, and a connecting portion, on the lower surface of the mount portion, which is connected to a corresponding pattern on the printed wiring board. A press member having elasticity which makes the press member press an upper surface of the IC package mounted on the socket body to press each terminal of the IC package against the contact portion of a corresponding pin terminal of the socket body is arranged on the socket body. A method of checking whether the connecting portion of each pin terminal is properly connected to a corresponding pattern on a printed wiring board by soldering is also disclosed.

REFERENCES:
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patent: 5340947 (1994-08-01), Credle et al.
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IBM Technical Disclosure Bulletin vol. 20 No. 11B, Apr., 1978. V.Y. Doo, "Liquid Metal Multihead Connector".

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