Method of making power substrate assembly

Details Method of making power substrate assembly Method of making power substrate assembly

1995-04-12

1997-12-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29831, 257717, 257720, 361779, 361783, H05K 336

Patent

active

056996098

ABSTRACT:
A fixture is provided for facilitating the fabrication of a motor controller of the type including a power substrate module and a control circuit board mounted to and electrically coupled to the power substrate module via a plurality of conductors. The fixture is preferably a ring-like structure made of epoxy-fiberglass laminate. Apertures for engaging and holding the conductors are provided in the fixture at locations corresponding to conducting pads on the power substrate module. For fabrication, the power substrate module and the fixture are preformed and solder is disposed on the conducting pads of the module. During fabrication, the conductors are inserted into the apertures in the fixture and the fixture and conductors are positioned over the preformed power substrate module to bring the conductors into contact with the conducting pads. The fixture and power substrate module are then passed through a reflow oven to melt the solder and complete the connection of the conductors to the module. The fixture is left in place and connections to the conductors, such as by installing a control circuit board, may be completed in subsequent process or assembly steps.

REFERENCES:
patent: 3893235 (1975-07-01), Keough
patent: 4074342 (1978-02-01), Honn et al.
patent: 4750092 (1988-06-01), Werther
patent: 4788767 (1988-12-01), Desai et al.
patent: 4996470 (1991-02-01), Rowan et al.
patent: 5008608 (1991-04-01), Unsworth et al.
patent: 5187419 (1993-02-01), DeLange

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