Method and apparatus for trimming lead wires projecting from pri

Details Method and apparatus for trimming lead wires projecting from pri Method and apparatus for trimming lead wires projecting from pri

1983-08-01

1985-05-07

Yost, Frank T.

Cutting

Processes

83368, 83422, 83437, 834771, 83563, 83925R, B23D 3302

Patent

active

045150486

ABSTRACT:
A rotary cut-off blade is mounted on a motor shaft and is moved axially with the motor into contact with the outer surface of a printed circuit board having an inner surface engaging a vertical side wall or plate of a suction box supported for horizontal reciprocating movement. The printed circuit board supports electronic components which project into the suction box, and soldered lead wires project outwardly through holes within the board. The blade is retracted by a predetermined minute distance and then rotated by the motor while the printed circuit board is moved horizontally past the blade with the suction box to shear the projecting lead wires at the predetermined distance from the outer surface of the board and independently of the thickness of the board.

REFERENCES:
patent: 3307442 (1967-03-01), Imhoff
patent: 3453918 (1969-07-01), Sharp
patent: 4072077 (1978-02-01), Morgan
patent: 4200018 (1980-04-01), Sekiwa
patent: 4253360 (1981-03-01), Zontelli
patent: 4463636 (1984-08-01), Heller et al.

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