Method of forming field-effect transistors using selectively bea

Metal working – Method of mechanical manufacture – Assembling or joining

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29576B, 29576T, 148187, 357 91, H01L 21265, H01L 21306, H01L 21268

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045148953

ABSTRACT:
A method of manufacturing MOS field-effect transistors using a wafer (40) having a polycrystal or amorphous semiconductor layer formed on an insulator comprises a step in which an energy beam (44) is applied to the semiconductor layer by scanning the beam intermittently and correlatively to the wafer so as to heat locally the semiconductor layer whereby only a plurality of portions (41) contained in the semiconductor layer and assigned for forming channel regions of MOS field-effect transistors are monocrystallized or the crystalline grains in the above described positions are made large. According to the present invention, a strain occurring in a recrystallized semiconductor can be mitigated by the selective heating.

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Fowler et al., IBM-TDB, 24 (1981) 1090.

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