Method for testing and mounting integrated circuits onto printed

Details Method for testing and mounting integrated circuits onto printed Method for testing and mounting integrated circuits onto printed

1997-07-24

1999-09-07

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29719, 29741, 29840, 228 62, 22818021, 228212, 324754, H05K 334, B23K 3102, B23P 1900, G01R 3100

Patent

active

059467916

ABSTRACT:
An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

REFERENCES:
patent: 3612955 (1971-10-01), Butherus et al.
patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 4620663 (1986-11-01), Odashima et al.

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