Method of making high density complementary transistors

Metal working – Method of mechanical manufacture – Assembling or joining

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29571, 148 15, 148187, 357 42, 357 91, H01L 2122, H01L 2978, H01L 1114

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044621515

ABSTRACT:
A simple process is provided which forms a bulk CMOS structure by depositing a layer of material which resists oxidation, e.g., a barrier layer of silicon nitride on an N- semiconductor substrate, forming a P well in the substrate through a given segment of the barrier layer, removing a first segment of the barrier layer to form N+ regions for N channel source and drain and N- substrate contact, removing a second segment of the barrier layer to form a P+ field region, removing a third segment of the barrier layer to form P+ regions for source and drain of a P channel device, forming a first control electrode having a given work function for the P channel device which acts as an ion barrier and then forming a second control electrode between the N channel source and drain regions having a work function different from that of the first control electrode.

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