Printed circuit assembly with fine pitch flexible printed circui

Details Printed circuit assembly with fine pitch flexible printed circui Printed circuit assembly with fine pitch flexible printed circui

1994-09-26

1998-02-17

Sparks, Donald D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174254, 174261, 361749, 361790, 361767, 361803, 439 66, 439 91, H05K 111, H05K 114, H01R 2372

Patent

active

057197490

ABSTRACT:
A printed circuit assembly includes a fine pitch flexible printed circuit overlay bonded to a normal pitch printed circuit board. The fine pitch flexible printed circuit overlay may provide increased packaging density, direct chip attachment and/or complex routing with a minimal cost impact on the overall printed circuit assembly.

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Art Burkhart, "Recent Developments in Flip Chip Technology", Surface Mount Technology, Jul. 1991, pp. 41-44.

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