Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1994-05-26
1996-10-29
Monin, Donald
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257703, 257762, 174265, 2281245, H01B 1726, H01H 102
Patent
active
055699588
ABSTRACT:
Hermetically sealed chip packages are described which are capable of withstanding elevated temperatures and accompanying temperature fluctuations. The chip packages feature electrically conductive, hermetic vias which provide electrical pathways through generally dielectric ceramic substrates employed in the chip package. Methods of forming such hermetic vias are also disclosed.
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CTS Corporation
Monin Donald
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