Polyimide adhesive and method of making from lactam, dianhydride

Details Polyimide adhesive and method of making from lactam, dianhydride Polyimide adhesive and method of making from lactam, dianhydride

1985-04-25

1987-04-14

Anderson, Harold D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

4284735, 524600, 524611, 528170, 528179, 528182, 528187, 528222, 528223, 528224, 528229, 528312, 528313, 528315, 528323, 528324, C08G 6914

Patent

active

046580107

ABSTRACT:
Methods of making modified polyimide adhesives and laminating compositions. These adhesives are also particularly useful as the matrix material in high strength fiber reinforced composites. The adhesive compositions are prepared by initially reacting an oxoimine with one or more tetracarboxylic acid dianhydrides, which is primarily 1, 2, 3, 4-butanetetracarboxylic acid dianhydride. The resulting bisimide is dissolved in a non-reactive solvent and a suitable diamine is added to react with the bisimide, producing a liquid resin solution which is essentially a polyamide resin solution. This solution is useful as an adhesive or a fiber composite matrix which can be cured to a polyimide at moderate processing temperatures. The final adhesive bond or matrix is found to be flexible, strong and very resistant to flame, high temperatures, oils and solvents.

REFERENCES:
patent: 3310506 (1967-03-01), Amborski et al.
patent: 4183839 (1980-01-01), Gagliani
patent: 4600770 (1986-07-01), Gagliani et al.

Affiliated with

Also associated with

Rating

Polyimide adhesive and method of making from lactam, dianhydride does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyimide adhesive and method of making from lactam, dianhydride, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide adhesive and method of making from lactam, dianhydride will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1786866