Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1997-03-06
2000-06-27
Kincaid, Kristine
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257723, 257693, H01L 2302
Patent
active
060809310
ABSTRACT:
A semiconductor package is disclosed, including: (a) two semiconductor chips having a plurality of bonding pads; (b) an insulating circuit film having (i) an insulating base film with a plurality of through holes, (ii) a plurality of first metal lines formed on upper and lower faces of the base film, (iii) a plurality of protruding, conductive inner pads which are respectively formed on the first metal lines, being respectively connected to said bonding pads of each semiconductor chip, (iv) a plurality of protruding, conductive outer pads which are formed on the first metal line at a predetermined interval from the plurality of inner pads, and (v) a plurality of second metal lines formed along wall surface of the plurality of through holes to connect to the inner pads of each semiconductor chip, for electrically connecting inner pads each other which are positioned at the upper and lower surfaces of the base film, (c) a lead frame including an inner lead for connecting the outer pads of the insulating circuit film to an external device so that the semiconductor chips are attached to the insulating circuit film in a manner such that the upper surfaces where the bonding pads are arranged, face each other.
REFERENCES:
patent: 5331235 (1994-07-01), Chun
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5468995 (1995-11-01), Higgins, III
patent: 5477082 (1995-12-01), Buckley, III et al.
Park Kyei Chan
Roh Kil-Sub
Hyundai Electronics Industries Co,. Ltd.
Kincaid Kristine
Ngo Hung V
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