Resin molding method in which a movable cavity piece allows a di

Details Resin molding method in which a movable cavity piece allows a di Resin molding method in which a movable cavity piece allows a di

1998-05-01

2000-06-27

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Producing multilayer work or article

26427217, 264276, 2643284, 264316, 425116, 425544, B29C 4502, B29C 7070

Patent

active

060803541

ABSTRACT:
A resin molding method by which resin is filled into a cavity while an article to be molded is clamped between upper and lower molding dies, wherein a cavity indentation is formed from an end face of a cavity piece provided in a cavity hole formed in the molding piece and of an internal wall surface of the cavity hole, the method including the steps of: arranging the cavity piece provided in the lower molding die so as to be movable in a direction in which the molding dies are opened or closed; covering a parting surface of each of the resin molding dies with a release film; sucking the release film from an area in the vicinity of an inner bottom surface of the cavity indentation of the lower molding die, to thus form a storage section for storing resin used for a molding operation within the cavity hole; feeding a required amount of resin to the storage section; setting the article on the lower molding die and clamping the article between the resin molding dies; and pressing the cavity piece of the lower molding die to a resin molding position to thus cause the resin provided in the cavity to set, thereby molding the article with resin.

REFERENCES:
patent: H1654 (1997-06-01), Rounds
patent: 4347211 (1982-08-01), Bandoh
patent: 4650626 (1987-03-01), Kurokawa
patent: 5098626 (1992-03-01), Pas
patent: 5674343 (1997-10-01), Hotta et al.
patent: 5735040 (1998-04-01), Ochi et al.
patent: 5800841 (1998-09-01), Miyajima
Semiconductor Packing Update, The Industry's First Newsletter Devoted to Semiconductor Packaging; 1994 vol. 9, No. 6, Editior and Publisher: Dr. Subashi Khadpe.

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