Mold transfer apparatus and method

Details Mold transfer apparatus and method Mold transfer apparatus and method

1995-11-21

1998-02-17

Ramsey, Kenneth J.

Metal fusion bonding

Process

Preplacing solid filler

22818022, 164 98, H01L 21441

Patent

active

057183678

ABSTRACT:
The present invention relates generally to a new mold transfer apparatus and method. More particularly, the invention encompasses an apparatus that is used to form metallic interconnections, such as, for example, solder connections, such as, solder balls or solder columns, using a mold that is already filled with transferable metallic material. However, these metallic interconnections in a mold could also be used to form other structures, such as, for example, heat sinks with fins, etc.

REFERENCES:
patent: 4893403 (1990-01-01), Hefling et al.
patent: 5381848 (1995-01-01), Trabucco
patent: 5388327 (1995-02-01), Trabucco

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