Method of soldering

Details Method of soldering Method of soldering

1993-05-11

1994-11-08

Bradley, P. Austin

Metal fusion bonding

Process

Applying or distributing fused filler

228258, B23K 3102, B23K 3514, B23K 3704

Patent

active

053619730

ABSTRACT:
A solder is disposed outside a joint area without putting a solder foil in an area to be joined or performing preparatory soldering, and soldering is performed by making the melted solder permeate the joint area by a capillary phenomenon. Further, one member is supported by a solder, and a joint solder layer of desired thickness is obtained by use of a jig for supporting the one and the other member at a predetermined distance therebetween when the solder is melted. Further, if a solder outside a joint area is made to stand vertically in its longitudinal direction, and melted at such a state, pressure caused by self-weight is given to the melted solder, and oxide of the solder surface is separated from the melted solder, so that it is possible to further reduce the generation of voids.

REFERENCES:
patent: 3327892 (1967-06-01), Lloyd et al.
patent: 3805373 (1974-04-01), Savolainen et al.
patent: 5172852 (1992-12-01), Bernardoni et al.

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