Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1980-03-03
1982-02-23
Parker, Roscoe V.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156154, 51277, B32B 3122
Patent
active
043167578
ABSTRACT:
Apparatus and method for wax mounting of thin wafers such as slices of semiconductor silicon to a carrier for polishing wherein the carrier is heated after being coated with wax which is maintained in a sticky condition by the heated carrier. A chamber is utilized for enclosing the thin wafers on resilient supports with the sticky wax-coated, heated carrier disposed above them. The chamber has an air tight seal permitting it to be evacuated. After evacuation a pneumatic cylinder is utilized to press the carrier against the wafers, which adhere to the sticky wax coating. The chamber is vented then to atmospheric pressure, the wafers remaining mounted by the wax coating to the carrier for subsequent polishing. The method avoids entrapment of gas bubbles between wafers and carrier.
REFERENCES:
patent: 3475867 (1969-11-01), Walsh
patent: 3492763 (1970-02-01), Walsh
patent: 3562965 (1971-02-01), Lange
patent: 3681171 (1972-08-01), Hojo et al.
patent: 3970494 (1976-07-01), Pritchard
patent: 4067764 (1978-01-01), Walker
patent: 4283242 (1981-08-01), Regler et al.
Croskell Henry
Monsanto Company
Parker Roscoe V.
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