Module for information processing apparatus using stacked printe

Details Module for information processing apparatus using stacked printe Module for information processing apparatus using stacked printe

1994-02-17

1995-10-31

Schwartz, Larry I.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 68, 439654, 439 75, H05K 100

Patent

active

054624428

ABSTRACT:
In a connector having a plurality of first contact groups arranged in a predetermined pattern, conductors whose one ends are connected to the first contact groups, and a plurality of second contact groups arranged in a pattern corresponding to the pattern of the first contact groups, the conductors for connecting the first contact groups and the second contact groups cause portions of the first contact groups to be connected to the second contact groups at different positions within the above-described pattern. Accordingly, even when the contacts of the same sort of signal lines having one-to-one correspondence are allocated to the contact conductors located at the same positions within the boards for constituting the respective modules, the one-to-one correspondence can be maintained, and thus the printed-circuit boards of the modules can be commonly utilized.

REFERENCES:
patent: 3838317 (1974-09-01), Coyne
patent: 5064378 (1991-11-01), Olson
patent: 5190481 (1993-03-01), Ju
patent: 5242319 (1993-09-01), Ju
IEEE Compcon Spring 1992, tutorial #4, "Advances in Bus Architecture and Theory", FSCEM: Stacking Modules, and FSCEM: Mechanical by Paul L. Borrill.

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