Configuration for temperature treatment of substrates, in partic

Details Configuration for temperature treatment of substrates, in partic Configuration for temperature treatment of substrates, in partic

1984-02-02

1986-05-13

Favors, Edward G.

Heating

Heat generator with an associated work support or heat...

Article engaging and retaining support fixes position of...

432232, F24J 300

Patent

active

045883793

ABSTRACT:
Configuration for temperature treatment of substrates, in particular semiconductor crystal wafers, comprised of a carrier for receiving the substrates to be treated, a frame-like support for receiving the carrier, whereby the frame-like support is connected to a time-controlled compressed air cylinder and can be shifted in axial direction by means of a roller guide, as well as heating devices. The heating devices are connected to a vacuum suction configuration, and includes one, disk-shaped heating plate with a flute type opening on top, to which the substrates contained in carrier are vacuum sucked. The configuration is used for low temperature processes used in conjunction with semiconductor technology, especially photolithographic processes, and eliminates unnecessary reloading or other rearranging procedures.

REFERENCES:
patent: 3540704 (1970-11-01), Wilson et al.
patent: 4445850 (1984-05-01), Hansen, Jr. et al.
patent: 4531909 (1985-07-01), Takeshita

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