Assemblage and method for relieving overpressure in an enclosure

Static structures (e.g. – buildings) – Controlled by condition responsive means

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Details

52202, 52DIG4, 494781, 220230, 22020301, 220 891, E04B 198

Patent

active

054618312

ABSTRACT:
An assemblage (10) for relieving overpressure in an enclosure (12) has a first panel (14) configured to surround an opening (13) in the enclosure (12), The first panel (14) comprises an outer skin (19) and a thermal barrier layer (15) for providing insulation during normal operation, A gasket member (24) is bonded to the thermal barrier layer (15) between panel edges (22). The gasket member (24) includes a magnetic portion (26) comprising magnets (23) encased in outer layer (16) for releaseably sealing the first panel (14) to the enclosure (12) and a bellows portion (28) for accommodating movements in the first panel (14) during thermal expansion.

REFERENCES:
patent: 2958912 (1960-11-01), Bower et al.
patent: 3048902 (1962-08-01), Hastings et al.
patent: 3111728 (1963-11-01), Alderfer
patent: 3167931 (1965-02-01), Bryson
patent: 3882637 (1975-05-01), Lindenschmidt
patent: 4387541 (1983-06-01), Boomershine
patent: 4409758 (1983-10-01), Dickerson et al.
patent: 4454686 (1984-06-01), Stapenell
patent: 5271189 (1993-12-01), Vincent et al.

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