Peripheral to area adapter with protective bumper for an integra

Details Peripheral to area adapter with protective bumper for an integra Peripheral to area adapter with protective bumper for an integra

1993-02-16

1994-02-22

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257778, 361749, 361760, 361807, 437209, 439 68, 439 69, H05K 702, H01R 909

Patent

active

052893464

ABSTRACT:
An peripheral to area adapter for an integrated circuit chip. The adapter comprises pads on an upper surface of a support in a pattern corresponding to the terminals on a integrated circuit, planar reroute lines on the upper surface with first ends at the pads, and vertical conductive vias extending through the support. The vias are connected at the upper surface to the second ends of the reroute lines. The vias are connected at the lower surface of the support to an area array of coupling elements. A protective bumper attached to the sides of the package provides mechanical shielding for the chip. The pads and reroute lines can be fabricated on a tape-automated-bonding (TAB) frame support and personalized to match a particular configuration of terminals or bumps on a chip. The coupling elements can form a generic array compatible with a wide variety of interconnect substrates.

REFERENCES:
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5029325 (1991-07-01), Higgins, III et al.
Siemens Forsch-u Entwickl-Ber. Bd 17 (1988) Nr. 5.

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