Heat dissipating interconnect tape for use in tape automated bon

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29827, 428573, 206330, 357 70, 361421, H05K 720

Patent

active

048498572

ABSTRACT:
The present invention is directed to an interconnect tape for TAB and electronic packages made from the tape. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heatsink. The tape leads, the heat dissipating pad and the support members for the heat dissipating pad are all formed from the same electrically conductive strip.

REFERENCES:
patent: 3611061 (1971-10-01), Segerson
patent: 3802069 (1974-04-01), Thompson
patent: 3821847 (1974-07-01), Melse
patent: 4209355 (1980-06-01), Burns
patent: 4234666 (1980-11-01), Gursky
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4394530 (1983-07-01), Kaufman
patent: 4410927 (1983-10-01), Butt
patent: 4449165 (1984-05-01), Kaufman
patent: 4472876 (1984-09-01), Nelson
patent: 4474292 (1984-10-01), Tehrani
patent: 4510017 (1985-04-01), Barber
patent: 4514750 (1985-04-01), Adams
patent: 4524238 (1985-06-01), Butt
patent: 4607276 (1986-08-01), Butt
patent: 4656499 (1987-04-01), Butt
patent: 4684975 (1987-08-01), Takiar et al.
patent: 4701363 (1987-10-01), Barber
patent: 4704187 (1987-11-01), Fujita
patent: 4721993 (1988-01-01), Walter
patent: 4735678 (1988-04-01), Mandigo et al.
patent: 4736236 (1988-04-01), Butt
patent: 4736882 (1988-04-01), Winter et al.
patent: 4742024 (1988-05-01), Sugimoto et al.
"TAB Technology Tackles High Density Interconnections" by Tom Dixon, Electronic Packaging & Production, Dec. 1984, pp. 34-39.
"Future Packages' Heat Transfer Will Affect PCB Designs" by Ernel R. Winkler, Electronic Packaging & Production, Apr. 1985, pp. 104-109.
"Advanced Packaging for VLSI" by Charles J. Bartlett, Solid State Technology, Jun. 1986, pp. 119-123.
"Microelectronic Packaging" by Albert J. Blodgett, Jr., Scientific America, Jul. 1983, pp. 86-96.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heat dissipating interconnect tape for use in tape automated bon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat dissipating interconnect tape for use in tape automated bon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat dissipating interconnect tape for use in tape automated bon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-176316

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.