Electrical device cooling system using a heat sink attached to a

Details Electrical device cooling system using a heat sink attached to a Electrical device cooling system using a heat sink attached to a

1992-06-15

1993-11-02

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 257718, 257720, 361414, 361792, H05K 720

Patent

active

052588874

ABSTRACT:
An electrical device mounting system employing a plurality of heat conductive layers embedded in a printed circuit board where heat conduction therebetween is facilitated by a plurality of heat conduction channels passing through one layer to another where the heat generated by the semiconductor device is conducted into the conducting layers via the heat conduction channels and into a heat dissipation device, such as an aluminum heat sink.

REFERENCES:
patent: 4479140 (1984-10-01), Horvath
patent: 4535385 (1985-08-01), August
patent: 4547834 (1985-10-01), Dumont
patent: 4729061 (1988-03-01), Brown
patent: 4810563 (1989-03-01), DeGree
patent: 5043845 (1991-08-01), McDermott
patent: 5089936 (1992-02-01), Kojima
patent: 5155661 (1992-10-01), Nagesh

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